| Procedure: |
- Engage tool in Coral
- Turn on power switch, located on the lower right hand side of the machine.
- Choose which workstation is needed:
- Clamping- used for smaller packages and pieces
- Non-clamping- used for larger samples and full wafers
- Set workstation height:
- Use silver side of the height gauge
- Adjust height of the workstation, so that it is flush with the silver side of the height gauge when the workstation is placed on the steel spacing plate.
- Mount sample on workstation.
- Place the spacer plate and workstation on the wirebonder.
- Adjust focus and zoom on microscope so that the bonding area is in focus. (The tip should be visible in the upper view of the microscope.)
- Using the lever on the right hand side of the tool, slowly lower the bonding tip down to the pad you want to make the 1st bond on.
- Push lever down until it stops and then slowly allow it to return to its original position.
- Move sample to 2nd bond position, and repeat bonding procedure.
Adjusting Loop Height
- Make 1st bond.
- Adjust Loop Height dial to proper setting.
- Make 2nd bond.
Replacing Tip
New tips are stored in table drawer.
- Using small Allen wrench, loosen the screw holding the tip.
- Remove and throw old tip away.
- Remove new tip from vial.
- Install new tip so that its top is flush with the transducer arm.
- Tighten screw with Allen wrench, being careful not to over-tighten.
Threading Tip
Note: This can be somewhat difficult and is best to have a hands-on training by staff.
- Use 5ASA tweezers with good tips, Hold the wire about 1” above the end and carefully angle the wire down into the top of the tip.
- When the wire starts to come out of the bottom of the tip, grab the end of the wire and pull about 2” of wire through the tip.
- Feed the wire through the wire guide above the tip.
- Press and release the red “EFO” button on the front panel of the bonder. This will create a ball at the end of the tip.
- Make a couple of test bonds.
- Any problems encountered can be resolved by staff.
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